Packaging Lab · 2.5D / 3D

先進封裝實驗室

Logic and HBM on a silicon interposer: why it is built this way, and what makes it hard.

Package —

BANDWIDTH —

MEMORY —

INTERPOSER —

PACKAGE YIELD —

WARPAGE 25 °C —

T LOGIC / HBM —

晶片越做越大，封裝把它們接成一顆

When one die is not enough, the package becomes the computer.

BUILT WITH CLAUDE OPUS 5.5 · RUNS LIVE IN THE BROWSER