Final Test Board Lab · Package Test (FT)

成品測試板拆解實驗室

Take a final-test interface apart in your browser — tester to solder ball.

Results tray #1
TESTED 0
FIRST-PASS YIELD —
THROUGHPUT —
INSERTIONS / SOCKET 0
SINCE CLEAN 0
PICK取料
PLACE移到測試座
PLUNGE下壓接觸
TEST電性測試
SORT分類
從晶圓到成品,每一顆都要碰兩次
Every chip gets touched twice — once on the wafer, once in the package.
BUILT WITH CLAUDE OPUS 5.5 · RUNS LIVE IN THE BROWSER