Hybrid Bonding Lab · copper to copper, no solder

混合鍵合實驗室

Two chips face to face, joined by millions of copper pads.

Stack —

PITCH —

PADS / mm² —

ENERGY / BIT —

CU GAP MARGIN —

CONTACT R —

STACK YIELD —

接點越密，表面就要越平、越乾淨、對得越準

The denser the joints, the flatter, cleaner and better aligned the surfaces must be.

BUILT WITH CLAUDE OPUS 5.5 · RUNS LIVE IN THE BROWSER