Glass & Panel Lab · a bigger foundation

玻璃基板實驗室

Bigger AI packages need flatter, larger substrates: glass cores, square panels and through-glass vias.

Package —

WARPAGE 25/260°C —

BOARD JOINTS —

UNITS PER CARRIER —

AREA USED —

TGV CRACK RISK —

DRILL / PANEL —

封裝越做越大，地基也要換：從圓的晶圓到方的面板，從有機到玻璃

As packages grow, the foundation changes: from round wafers to square panels, from organic to glass.

BUILT WITH CLAUDE OPUS 5.5 · RUNS LIVE IN THE BROWSER