CMP Lab · polish every layer flat

化學機械研磨實驗室

Press, spin and pour slurry: grind a whole wafer flat to a few nanometres.

CMP —

REMOVAL RATE —

POLISH TIME —

PAD TEMP —

DISHING —

EROSION —

SLURRY / WAFER —

每一層都要先磨平，下一層才蓋得上去

Every layer must be polished flat before the next one can be built.

BUILT WITH CLAUDE OPUS 5.5 · RUNS LIVE IN THE BROWSER