Backside Power Lab · power from below

背面供電實驗室

Moving the power wiring to the back of the wafer: IR drop, bonding, heat and debug.

Power —

PEAK IR DROP —

CLOCK SPEED —

CELL UTILISATION —

HOTSPOT —

BACKSIDE OVERLAY —

LASER DEBUG —

把電從背面送進去，正面就留給訊號

Feed the power from the back, and the front is left for signals.

BUILT WITH CLAUDE OPUS 5.5 · RUNS LIVE IN THE BROWSER